Cold plasma

Advanced surface treatment with Micro Cold Plasma

Cold plasma – Micro Cold Plasma (MCP) – is used for optimum surface cleaning and surface activation, especially on extremely sensitive substrates. Surface activation via plasma is really effective where materials, especially synthetic substances and synthetic surfaces, which structure is often nonpolar have to be pretreated. The atmospheric MCP-Technology enables the cleaning, the activation and the coating of surfaces with plasma at nearly all possible materials – from plastics, over metals, glass, even carton, textiles and composite materials.

With our  MCP-Technology the plasma surface treatment can be implemented inline. This enables the use of economical source materials, the combination of materials which where incompatible so far and high efficient, environmentally friendly manufacturing processes.

The optimised plasma jets are characterised by high power density in the plasma, as well as low gas or air consumption. All MCPsystems can be adjusted to the process conditions and the substrates via the operating parameters, in order to functionalize the surface as cost-effectively as possible. Further on the systems are designed for the high demands of industrial continous operations.

Areas of application

• Selective surface activation before imprinting, gluing or paintwork to optimize adhesion
• Gluing of dissimilar materials
• Pretreatment of injection components

Gluing processes

• Nearly all synthetic substances can be treated
• Gluing of dissimilar materials

Coating processes

• Better adhesion of the coating

Printing processes

• Constant plasma treatment over the whole surface
• Better adhesion properties and through that the surface keeps its quality over a long time

General advantages

• Increased surface tension for perfect adhesion or printing
• Minimum energy input (thermal load on the substrate)
• At atmospheric pressure (no vacuum, no special atmosphere)
• Good wettability (for disinfection and perfect adhesion)

Advantages of the MCP-Technology

• Better reachability of areas which are diffcult to access because of the nozzle construction
• Better space- and installation possibilities caused by compact power electronics and longer hose assemblies
• Lower temperatures at the nozzle (max. 255°C)
• Lower operating costs

– no reactive power loss
– lower compressed air consumption

• High process speed
• High product life of the nozzle (min. 400h)
• Low-maintenance continuous operation




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